Note 1：

CAUTION - The "accelerated equivalent"soak requirements shall not be used until correlation of damage response , including electrical , after soak and reflow is established with the "standard" soak requirements or if the known activation energy for diffusion is 0.4 - 0.48 eV , Accelerated soak times may vary due to material properties , e.g. mold compound , encapsulant , etc. JEDEC document JESD22-A120 provides a method for determining the diffusion coefficlent.

Note 2：

The standard soak time includes a default value of 24 hours for semiconductor manufacture's exposure time (MET) between bake and bag and includes the maximum time allowed out of the bag at the distributor's facility . If the actual MET is less than 24 hours the soak time may be reduced . For soak conditions of 30 ℃/60% RH the soak time is reduced by 1 hour for each hour the MET is less than 24 hours , For soak conditions of 60 ℃/60% RH , the soak time is reduced by 1 hour for each 5 hours the MET is less than 24 hours .If the actual MET is greater than 24 hours the soak time must be increased , If soak conditions are 30 ℃/60% RH the soak time is increased by 1 hour. for each hour that the actual MET exceeds 24 hours . If soak conditions are 60 ℃/60% RH ,the soak time is increased 1 hour . for each 5 hours that the actual MET exceeds 24 hours .

Note 3：

Supplier may extend the soak times at their own risk .