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TXC announces a new series of miniaturized Oven-Controlled Crystal Oscillator (OCXO). (OG product series) TXC Corporation

OG Product Outline


TXC newly developed world's smallest SMD-type miniaturized OCXO in 9.7mm x 7.5mm x 5.5mm package size. It combines a miniature oven structure design with high stability SC-cut SMD X’tal, and integrated circuit technology to achieve excellent temperature stability, low phase noise, high frequency stability against airflow environment and superior reliability compared to traditional discrete OCXO. The miniaturized package size could reduce the power consumption and also save the layout space.
TXC’s OG-series could be the best reference clock choice for telecommunication infrastructure, Base station, Small cell, OTN, PTN, Switch, Router, precise timing network such as IEEE1588, SyncE, and Smart Grid, testing equipment…etc.






Features Benefits
SC-cut Crystal Unit (a) Low phase noise
(b) Low aging performance
(c) Excellent short-term stability
Miniaturized Oven Structure (a) High temperature stability
(b) High frequency stability against airflow environment
Highly Integrated Circuit Technology ASIC based, superior reliability compared to traditional discrete OCXO
Small Package Size (a) Low power consumption
(b) Layout space saving


Product Dimensions


Electrical Specifications

Item/Parameter OG-series
Output Type           CMOS /        Clipped Sinewave
Frequency Range 10, 12.8, 19.2, 20, 30.72, 40 MHz
Frequency Stability ±10~±50ppb
Operation Voltage 3.3V
Current Consumption Steady <0.5W
Operating Temperature Range - 40 ~ 85 ℃
Storage Temperature Range - 55 ~ 125 ℃
Short-term Stability Allan Deviation <5.0E-11/s
Aging Performance <±500ppb 1st year
<±2.0ppm 20 years


Frequency Stability over Temperature


Phase Noise & Phase jitter


For more information and sample inquiry, please contact our local office or email via sample request form (http://www.txccorp.com/index_en.php?action=b_products_need).

TXC Spokesperson:


TXC Deputy Spokesperson:

Sophia--Special Assistant to President

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